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  sp3 Diamond Technologies is your partner for high heat flux thermal management applications, with its CVD diamond DiaTherm™ heat spreaders for device level approaches and its Silicon-on-Diamond (SOD) wafers for circuit level challenges. Emerging microelectronic components -- such as high speed processors, wide bandgap Radio Frequency and power conversion devices and opto-electronic devices (LEDs, Laser Diodes) -- generate exceptionally high heat densities that require innovative approaches to thermal management.
The materials commonly implemented to dissipate heat are reaching the limits of their thermal conductivity, forcing the global electronics manufacturing market to consider alternatives. Freestanding diamond has tremendous potential for electronics applications, because it significantly improves upon current strategies for thermal management, while remaining highly cost-competitive with more esoteric approaches. Implementing the intrinsic characteristics of diamond, sp3 Diamond Technologies developed DiaTherm heat spreaders for those applications that can no longer be cooled by traditional passive heat dissipation materials. DiaTherm, with its 1000 to 1400W/mK thermal conductivity has demonstrated its ability to improve a devices' reliability margin or provide longer lifetime, while increasing power by up to 300 percent (in the case of lasers and LEDs). This is possible through the decrease in device junction temperature, achieved by the rapid removal of heat due to the extreme thermal conductivity of diamond. DiaTherm is available in custom sizes either as bare material or as patterned, metallized segments ready for device attachment. SOD wafers are currently being developed as 100 mm substrates but can be available in other dimensions.
For more information on sp3 products and services for thermal management applications, please see:  |
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